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EMERGE™ advanced resins are a family of material solutions specifically targeted to meet the complex requirements of the growing Information Technology Equipment (ITE) market. Compared to conventional engineering thermoplastics, they offer unique performance characteristics, including enhanced physical properties, better processability, improved ignition resistance and recyclability tailor made to fit the requirements of consumer electronics manufacturers.
- EMERGE 8600/CELEX™ 3600 for adapter housing or high-aesthetic housing:
- EMERGE 7560/CELEX 5200HF IR-PC/ABS for various ITE enclosures:
- EMERGE 4902/CELEX 310HF for supporting frames in back light units of LCD displays
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CELEX™ 310HF.B |
PC |
1.26 (ASTM D792) |
18 (300°C/1.2 kg, ASTM D1238) |
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CELEX™ 310HF.M |
PC |
1.28 (ASTM D792) |
18 (300°C/1.2 kg, ASTM D1238) |
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CELEX™ 310HF |
PC |
1.24 (ASTM D792) |
19 (300°C/1.2 kg, ASTM D1238) |
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CELEX™ 320.N |
PC |
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6.0 (300°C/1.2 kg, ASTM D1238) |
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CELEX™ 330AD |
PC |
1.43 (ASTM D792) |
12 (256°C/3.8 kg, ASTM D1238) |
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CELEX™ 3600-10 |
PC |
1.20 (ASTM D792) |
10 (300°C/1.2 kg, ASTM D1238) |
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CELEX™ 3600-20 |
PC |
1.20 (ASTM D792) |
20 (300°C/1.2 kg, ASTM D1238) |
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CELEX™ 501.C |
ABS+PC |
1.12 (ASTM D792) |
8.3 (230°C/3.8 kg, ASTM D1238); 30 (250°C/5.0 kg, ASTM D1238); 36 (260°C/5.0 kg, ASTM D1238) |
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CELEX™ 5200HF.IM |
ABS+PC |
1.17 (ASTM D792) |
17 (230°C/3.8 kg, ASTM D1238); 75 (260°C/5.0 kg, ASTM D1238) |
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CELEX™ 5200HF |
PC |
1.18 (ASTM D792) |
19 (230°C/3.8 kg, ASTM D1238) |
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