LNP THERMOCOMP JF-1004EP

LNP Thermocomp thermocomp compounds

THERMOCOMP GF004(GF-1004)        
LNP* Thermocomp* GF004 is a compound based on Polysulfone resin containing 20% Glass Fiber.

LNP THERMOCOMP D351 (experimental grade name as EXTC8143)

Glass Fiber filled Flame Retardant PC . Added features of this material include: High modulus, good flatness, good ductility, Non-Brominated & Non-Chlorinated Flame Retardant.

,

LNP Thermocomp D451RC (experimental grade name as EXTC8484) 
Recycle Polycarbonate resin containing Glass Fiber, Flame Retardant. Added features of this material include: high modulus, good flatness, good ductility, Non-Brominated & Non-Chlorinated Flame Retardant. 
,

THERMOCOMP DZ004(DF-1004M)        
LNP* Thermocomp* DZ004 is a compound based on Polycarbonate resin containing 20% Milled Glass.    

    
THERMOCOMP GF006(GF-1006)        
LNP THERMOCOMP* GF006 is a compound based on Polysulfone resin containing 30% Glass Fiber.  

      
THERMOCOMP JF004E(JF-1004EM)        
LNP* THERMOCOMP* JF004E is a compound based on Polyethersulfone resin containing 20% Glass Fiber. Added features of this material include: Easy Molding.

       
THERMOCOMP KF008(KFX-1008)        
LNP THERMOCOMP* KF008 is a compound based on Acetal Copolymer resin containing 40% Glass Fiber.

       
THERMOCOMP RF006ESZ(RF-1006EMHS)        
LNP THERMOCOMP* RF006ESZ is a compound based on Nylon 66 resin containing 30% Glass Fiber. Added features of this material include: Easy Molding, Heat Stabilized.

        
THERMOCOMP UF009S(UF-1009HS)        
LNP THERMOCOMP* UF009S is a compound based on Polyphthalamide resin containing 45% Glass Fiber. Added features of this material include: Heat Stabilized.

LNP THERMOCOMP JF002R 
a compound based on Polyethersulfone resin containing Glass Fiber, Glass Bead. Added features of this material include: Mold Release.
Also known as: LNP* THERMOCOMP* Compound JF-1002 MG MR
Product reorder name: JF002R

THERMOCOMP JF006(JF-1006)        
LNP* THERMOCOMP* JF006 is a compound based on Polyethersulfone resin containing 30% Glass Fiber.

.

THERMOCOMP JF004(JF-1004)

Polyethersulfone resin containing 20% glass fiber.

.       
THERMOCOMP DF006(DF-1006)        
LNP THERMOCOMP* DF006P is a compound based on Polycarbonate resin containing 30% Glass Fiber.  

.

THERMOCOMP  RF-100-12 NAT

LNP thermocomp RF-100-12 is a compound based on nylon 66 resin containing glass fiber.

.

LNP THERMOCOMP UX08305 
PPA base glass fiber filled compounds, good for LDS (Laser direct structuring)application. Additional feature is high heat. 

**any questions ,Please e-mail to : x.g.chiang@gmail.com