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LDS (Laser direct structuring) Thermocomp DX14354X

LNP THERMOCOMP DX11354X-WH9G191
  • LNP THERMOCOMP DX11354X-WH9G191
  • XANTAR LDS 3730
  • Thermocomp DX11355
  • Thermocomp DX11355 BLACK
  • Thermocomp DX11354X WHITE
  • XANTAR LDS 3730 BLACK
  • THERMOCOMP DX11354X
  • XANTAR LDS MATERIALS
  • LDS+LCP RESIN
  • LDS+PA4T RESIN
  • LDS+PPA RESIN
  • Laser direct structuring(LDS)+PC RESIN
  • LDS PC+ABS
  • LNP THERMOCOMP DX109110
  • lnp thermocomp dx13354
  • LNP Thermocomp NX07354-BKNAT
Model No.︰LDS DX13354
Brand Name︰Laser direct structuring(LDS)
Country of Origin︰China
Unit Price︰US $ 0.01 / KG
Minimum Order︰25 KG
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Product Description

LDS (Laser direct structuring) materials: 

 

PC/ABS BASED

LNP THERMOCOMP NX07354
This is a PC/ABS compound, a good candidate for Laser Direct Structuring applications.

LNP THERMOCOMP NX11302
Polycarbonate + ABS compound with colorable, good plating, surface and mechanical performance, a good candidate for Laser Direct Structuring applications.
.
XANTAR LDS 3710
Laser Direct Structuring (LDS)*, Vicat 120°C, Black color only

 

PC BASED

XANTAR LDS 3730

Flame retardant(halogen free),black color only,LDS.

,

LNP THERMOCOMP Compound DX13354

New PC copolymer, Glass, Impact Modified, LDS function

,

LNP THERMOCOMP Compound DX13354X

New PC copolymer, Glass, Impact Modified, LDS function, Colorable

,

LNP THERMOCOMP Compound DX14354X

improved flow, colorable compound based on PC copolymer resin developed for applications that require LDS for antenna, or electronic circuit manufacturing.

,

LNP THERMOCOMP Compound DX15354

New PC copolymer, Glass, Impact Modified, LDS function

,

 

LNP THERMOCOMP Compound DX11354

This is a PC compound with good plating, surface and mechanical performance, a good candidate for Laser Direct Structuring applications

,

LNP THERMOCOMP Compound DX11354X 

a colorable PC based compound with stable plating and RF performance, colored LDS material solution, good surface and processing window, high impact strength. It is a general purpose product available in internal and external parts for Laser Direct Structuring applications.

,

LNP THERMOCOMP Compound DX11355

This is a PC based compound with good plating, surface, mechanical performance and flame retardant (Halogen free), a good candidate for Laser Direct Structuring applications.

,

 

PPA BASED

LNP THERMOCOMP Compound UX08325

PPA base glass fiber filled compounds, good for LDS application. Additional feature is high heat. 

,

LCP BASED

Celanese Vectra LCP E840i LDS  (MID/LDS),Plateable.

LNP THERMOCOMP INVENTORY LIST
Type Color No. Material Origin Available
DX109110 WH96163 PC CHINA 1,000 kg
DX13354 701 PC China 2,000 kg
NX07354 BKNAT PC+ABS CHIAN 5,000 KG
         
         
         
         
         
         
         
         
         

*The compound is intended specifically for the use in the process of manufacturing conducting path designs according to the German application of the patent 101 32 092 of LPKF Laser & Electronics AG. Please address straight to LPKF Laser & Electronics AG (www.LPKF.de).

**Any questions e-mail to:x.g.chiang@gmail.com 

Price Terms︰EXW/CIP/FOB/CIF
Payment Terms︰T/T
Packing︰25KG/BAG
Lead Time︰5 DAYS
Product Image

LNP THERMOCOMP DX11354X-WH9G191
LNP THERMOCOMP DX11354X-WH9G191

XANTAR LDS 3730
XANTAR LDS 3730

Thermocomp DX11355
Thermocomp DX11355

Thermocomp DX11355 BLACK
Thermocomp DX11355 BLACK

Thermocomp DX11354X WHITE
Thermocomp DX11354X WHITE

XANTAR LDS 3730 BLACK
XANTAR LDS 3730 BLACK

THERMOCOMP DX11354X
THERMOCOMP DX11354X

XANTAR LDS MATERIALS
XANTAR LDS MATERIALS

LDS+LCP RESIN
LDS+LCP RESIN

LDS+PA4T RESIN
LDS+PA4T RESIN

LDS+PPA RESIN
LDS+PPA RESIN

Laser direct structuring(LDS)+PC RESIN
Laser direct structuring(LDS)+PC RESIN

LDS PC+ABS
LDS PC+ABS

LNP THERMOCOMP DX109110
LNP THERMOCOMP DX109110

lnp thermocomp dx13354
lnp thermocomp dx13354

LNP Thermocomp NX07354-BKNAT
LNP Thermocomp NX07354-BKNAT

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