LDS LNP Thermocomp DX14354X

LDS LNP Thermocomp DX14354X

Model No.︰PC+ABS NX11302

Brand Name︰Laser direct structuring(LDS)

Country of Origin︰China

Unit Price︰US $ 0.01 / KG

Minimum Order︰25 KG

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Product Description

LDS (Laser direct structuring) materials: 

 

PC/ABS BASED

LNP THERMOCOMP NX07354
This is a PC/ABS compound, a good candidate for Laser Direct Structuring applications.

LNP THERMOCOMP NX11302
Polycarbonate + ABS compound with colorable, good plating, surface and mechanical performance, a good candidate for Laser Direct Structuring applications.

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LNP THERMOCOMP Compound DX06313I
30% glass fiber reinforced, impact modified polycarbonate resin. High flow and good ductility.
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LNP THERMOCOMP Compound DX10311 
30% glass fiber reinforced, impact modified polycarbonate resin. High flow and good ductility.
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LNP THERMOCOMP Compound DX13354

New PC copolymer, Glass, Impact Modified, LDS function

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LNP THERMOCOMP Compound DX13354X

New PC copolymer, Glass, Impact Modified, LDS function, Colorable

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LNP THERMOCOMP Compound DX14354X

improved flow, colorable compound based on PC copolymer resin developed for applications that require LDS for antenna, or electronic circuit manufacturing.

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LNP THERMOCOMP Compound DX15354

New PC copolymer, Glass, Impact Modified, LDS function

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LNP THERMOCOMP Compound DX11354

This is a PC compound with good plating, surface and mechanical performance, a good candidate for Laser Direct Structuring applications

,

LNP THERMOCOMP Compound DX11354X 

a colorable PC based compound with stable plating and RF performance, colored LDS material solution, good surface and processing window, high impact strength. It is a general purpose product available in internal and external parts for Laser Direct Structuring applications.

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LNP THERMOCOMP Compound DX11355

This is a PC based compound with good plating, surface, mechanical performance and flame retardant (Halogen free), a good candidate for Laser Direct Structuring applications.

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PPA BASED

LNP THERMOCOMP Compound UX08325

PPA base glass fiber filled compounds, good for LDS application. Additional feature is high heat. 

LNP THERMOCOMP INVENTORY LIST
Type Color No. Material Origin Available
DX109110 WH96163 PC CHINA 1,000 kg
DX13354 701 PC China 2,000 kg
NX07354 BKNAT PC+ABS China 5,000 KG
DX10311 701 PC-GF30 China 1,000 kg
NX11302 WH9E641 PC+ABS China 1,000 kg
         
         
         
         
         
         
DX06313I 701 pc-gf30 China 1,000 kg

*The compound is intended specifically for the use in the process of manufacturing conducting path designs according to the German application of the patent 101 32 092 of LPKF Laser & Electronics AG. Please address straight to LPKF Laser & Electronics AG (www.LPKF.de).

**Any questions e-mail to:x.g.chiang@gmail.com 

Price Terms︰ EXW/CIP/FOB/CIF

Payment Terms︰ T/T

Packing︰ 25KG/BAG

Lead Time︰ 5 DAYS

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